Resin Designs

TP-2160 Gap Filler Thermal Pad

TP-2160 Gap Filler Thermal Pad

A highly compressible, silicone gap filler with moderate bulk conductivity delivered with a highly conductive non-tacky surface on one side. This filler uses foam reinforcement to maintain compressibility while providing easy handling to simplify application and improve long-term reliability.  It is ideal for use in low-power applications requiring heat transfer across any large air gap

Overview

A highly compressible, silicone gap filler with moderate bulk conductivity delivered with a highly conductive non-tacky surface on one side. This filler uses foam reinforcement to maintain compressibility while providing easy handling to simplify application and improve long-term reliability.  It is ideal for use in low-power applications requiring heat transfer across any large air gap

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A highly compressible, silicone gap filler with moderate bulk conductivity delivered with a highly conductive non-tacky surface on one side. This filler uses foam reinforcement to maintain compressibility while providing easy handling to simplify application and improve long-term reliability.  It is ideal for use in low-power applications requiring heat transfer across any large air gap

Overview

A highly compressible, silicone gap filler with moderate bulk conductivity delivered with a highly conductive non-tacky surface on one side. This filler uses foam reinforcement to maintain compressibility while providing easy handling to simplify application and improve long-term reliability.  It is ideal for use in low-power applications requiring heat transfer across any large air gap

Specifications

Specific Gravity1.8

Memberships & Certifications

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TP-2160 Gap Filler Thermal Pad - Chase Corporation - Staging