A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate. It has an integrated adhesive/primer. The Sealant is VOC free when applied without a primer. When used with Tapecoat Omniprime it will meet even the strictest environmental laws.
Overview
A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate. It has an integrated adhesive/primer. The Tapecoat Moldable Sealant is VOC free when applied without a primer. When used with Tapecoat Omniprime it will meet even the strictest environmental laws.
A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate. It has an integrated adhesive/primer. The Sealant is VOC free when applied without a primer. When used with Tapecoat Omniprime it will meet even the strictest environmental laws.
Overview
A 60 mil, cold applied dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces; provides a seamless, water tight barrier preventing overwraps from bridging over the substrate. It has an integrated adhesive/primer. The Tapecoat Moldable Sealant is VOC free when applied without a primer. When used with Tapecoat Omniprime it will meet even the strictest environmental laws.
Specifications
| Packaging | CASE |
|---|---|
| Quantity per Package | 12 Rolls |
Downloads
Tapecoat Moldable Sealant Technical Data Sheet
PDFDownload
