A high temperature, cold applied, dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces, providing a seamless, water tight barrier preventing overwraps from bridging over substrates. The compound serves as an initial protection against corrosion and electrolysis on irregular fittings and hard-to-coat metal substrates.
Overview
A high temperature, cold applied, dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces, providing a seamless, water tight barrier preventing overwraps from bridging over substrates. The compound serves as an initial protection against corrosion and electrolysis on irregular fittings and hard-to-coat metal substrates. It requires the use of Roybond 747 Primer before application.
A high temperature, cold applied, dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces, providing a seamless, water tight barrier preventing overwraps from bridging over substrates. The compound serves as an initial protection against corrosion and electrolysis on irregular fittings and hard-to-coat metal substrates.
Overview
A high temperature, cold applied, dielectric putty. It is designed to be used as a filler material to fill gaps and voids and to contour irregular surfaces, providing a seamless, water tight barrier preventing overwraps from bridging over substrates. The compound serves as an initial protection against corrosion and electrolysis on irregular fittings and hard-to-coat metal substrates. It requires the use of Roybond 747 Primer before application.
Downloads
Royston Butyl Moldable Sealant Technical Data Sheet
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